Electrical/Electronic Materials
Rudolph Bros. & Co. offers a broad range of epoxy formulations designed to protect your assemblies from the degrading environmental and operation effects of chemical exposure, moisture, thermal cycle/shock, current leakage, and mechanical shock and vibration. The embedment of a device can be accomplished by a number of different methods including encapsulation, potting, coating, sealing, impregnation, conformal coating and transfer molding. The embedment of electronic components with our line of epoxy encapsulants can eliminate the effects of corrosion and minimize the problem of environmental circuit degradation.
Rudolph Bros. line of one- and two- component systems are available from inventory with a range of cure options which can be tailored to meet specific electrical, mechanical and thermal requirements. Certified products are designed to meet military specifications; others have UL® approval for fire resistance; others meet Medical/USP requirements. Rudolph Bros. one- and two-component epoxy encapsulants are specially designed for electrical/electronic applications. Formulated from Epoxy, these systems have proven reliable for electronic insulation because they offer:
- Excellent elevated temperature stability and thermal shock resistance.
- Minimal Shrinkage, and stress to critical components during cure.
- Outstanding electrical insulation at both room and elevated temperature.
- A wide range of handling and physical properties including working life, cure schedule, viscosity, thermal conductivity and hardness.
- Range of cure temperatures from below room temperature to 400° F.
- Minimal or no volatiles during cure.
- Excellent resistance to environments and chemicals.
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