BERGQUIST® GAP FILLER TGF 2000 Syringe 50cc
Item #:
HE2165968
Product Info
HENKEL ELECTRONICS
BERGQUIST® GAP FILLER TGF 2000 is a two component, thermally conductive, silicone based liquid gap filler. It can be cured at room temperature and the curing process can be accelerated with heat. This product exhibits low modulus and good compression set. It also exhibits excellent low and high temperature mechanical and chemical stability and hence is fit for use over a wide range of temperatures.
- Thermal conductivity: 2.0 W/m-K
- Ultra-conforming, designed for fragile and low-stress applications
- Ambient and accelerated cure schedules
- 100% Solids – no cure by-products
Item Specifications
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1.00 lbs per EA