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Electronic Materials/Potting and Encapsulation

Shin-Etsu KE-1223 Can 1kg

KE1223 1KG CAN
Item #: SEKE1223KG1

Product Info

SHIN-ETSU, SES AMERICA, INC.

Shin-Etsu KE-1223/CLA-3 is a UL 94 HB equivalent, dual component, heat cure, self-leveling potting encapsulant that will cure to form a durable, flexible rubber to protect electronic components. KE-1223/CLA-3 exhibits excellent thermal conductivity and unprimed adhesion to printed circuit board substrates, metals, plastics, glass, and ceramics.


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Item Specifications

  • 2.50 lbs per EA
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UOM : EA
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