EC-1009 Thermally Conductive Potting Compound 1 Gallon
Item #:
EX-EC1009/EH21GA
Product Info
EX-EC1109/EH21GA
EPOXY SET INC.
EPOXICAST EC-1009 is a pourable, filled epoxy resin system featuring high thermal conductivity, good electrical insulation, and low shrinkage during cure. It is useful for potting and encapsulating components and modules where removal of heat and resistance to mechanical and thermal shock are prime considerations. Typical Applications includes potting or encapsulating densely packaged power supplies, integrated circuits, small transformers, capacitors bushings etc.
Rudolph Bros. & Co. DOES NOT GUARANTEE that the information in any related documents is the most up to date information available from the manufacturer, there are times when updated information is released and we are not made aware of immediately.