MP5405NS 50ML

ASI MP5405NS 50ML

MP5405NS is a two part unfilled epoxy adhesive designed for high speed bonding of metals, ceramics, and most plastics. It cures to a tough semi-rigid material, and is a thixotropic paste consistency to prevent running and sagging. It gives good resistance to water, salt spray, inorganic acids and bases, and most organic solvents. It was especially formulated to a 1:1 mix ratio for use in either MMD equipment or side-by-side dual cartridges for easy dispensing.

A handling cure is normally achieved at room temperature within 20 – 30 minutes with full cure in 24 hours. An elevated temperature cure schedule can be used to reach final properties quickly