BERGQUIST® GAP FILLER TGF 2000 400cc Syringe
Item #:
HE2166091
Product Info
HENKEL ELECTRONICS
BERGQUIST® GAP FILLER TGF 2000 is a two component, thermally conductive, silicone based liquid gap filler. It can be cured at room temperature and the curing process can be accelerated with heat. This product exhibits low modulus and good compression set. It also exhibits excellent low and high temperature mechanical and chemical stability and hence is fit for use over a wide range of temperatures.
- Ultra-conforming, designed for fragile and low-stress applications
- Thermal conductivity: 2.0 W/m-K
- 100% Solids – no cure by-products
- Ambient and accelerated cure schedules