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BERGQUIST® GAP FILLER TGF 2000 Kit 400cc

BERQUIST GAP FILLER 2000 400CC KITS
Item #: HE2166234

Product Info

HENKEL ELECTRONICS

BERGQUIST® GAP FILLER TGF 2000 is a two component, thermally conductive, silicone based liquid gap filler. It can be cured at room temperature and the curing process can be accelerated with heat. This product exhibits low modulus and good compression set. It also exhibits excellent low and high temperature mechanical and chemical stability and hence is fit for use over a wide range of temperatures.

  • Thermal conductivity: 2.0 W/m-K
  • Ultra-conforming, designed for fragile and low-stress applications
  • Ambient and accelerated cure schedules
  • 100% Solids – no cure by-products

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