BERGQUIST® GAP FILLER TGF 4000
Item #:
HE2167392
Product Info
HENKEL ELECTRONICS
BERGQUIST® GAP FILLER TGF 4000 is a 4.0 W/m-K thermally conductive, ultra-conforming, silicone-based liquid gap filler (2-part). The mixed liquid system cures at room temperature or can be accelerated using heat. It offers extended working time for improved manufacturing flexibility and the low-level natural tack characteristics are ideal for assemblies where strong structural bonds are not required.
Item Specifications
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115.00 lbs per EA