BERGQUIST® GAP PAD TGP 3004SF
Item #:
HE2191835
Product Info
HENKEL ELECTRONICS
BERGQUIST® GAP PAD TGP 3004SF is a silicone free, thermally conductive gap pad. This product exhibits excellent thermal performance and thereby offers exceptionally low interfacial resistance to adjacent surfaces. This product has no silicone content and is therefore ideal for silicone sensitive applications. For information on UL certifications for our Thermal Management Materials Portfolio, please reference to UL file No. E59150.
- Thermal Conductivity: 3.0 W/m-K
- Silicone-free formulation
- Tacky side allows for ease of handling and placement
- 0.25 mil PET provides easy disassembly, leaving no residue
Item Specifications
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1.00 lbs per EA