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BERGQUIST® LIQUI FORM TLF LF3500

Item #: HE2322270

Product Info

HENKEL ELECTRONICS

BERGQUIST® LIQUI FORM TLF LF3500 is a thermally conductive, dispensable and highly conformable thermal management material with excellent chemical and mechanical stability. This product is designed to provide a balance between dispensability and low component stress during application and assembly and the unique formulation offers excellent thermal performance and low applied stress. For information on UL certifications for our Thermal Management Materials Portfolio, please reference to UL file No. E59150.


  • Dispensable pre-cured gel, requiring no mixing or refrigeration
  • Thermal conductivity: 3.5 W/m-K (ASTM D5470)
  • Stable viscosity in storage and in application
  • Excellent chemical and mechanical stability
  • Low compression set to reduce stress on components


Item Specifications

  • 1.50 lbs per EA
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UOM : EA
QTY:

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